发明名称 Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts
摘要 An interconnected circuit module and motherboard use an electrical edge connector with conductive polymer contacts. The circuit module has electrical terminals along an edge of a front surface, and the electrical terminals extend to plated cylindrical grooves that are formed in the edge surface of the circuit module. The electrical edge connector is fastened to a surface of the motherboard and receives the edge terminals of the circuit module. When the circuit module is secured in the edge connector, the conductive polymer contacts are aligned with the cylindrical grooves of the circuit module and compressed against a land grid array on the surface of the motherboard. The connector is able to transmit electrical signals between the circuit module and the motherboard without the used of electrical pin connections.
申请公布号 US6461169(B1) 申请公布日期 2002.10.08
申请号 US20010849506 申请日期 2001.05.04
申请人 INTEL CORPORATION 发明人 HARRISON JOE A.;RUTTAN TOM G.;MISCIO MATHEW C.
分类号 H01R13/24;H05K3/36;(IPC1-7):H01R12/00;H05K1/00 主分类号 H01R13/24
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