发明名称 Circuit board for mounting bare chip
摘要 A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.
申请公布号 US6462282(B1) 申请公布日期 2002.10.08
申请号 US19990338659 申请日期 1999.06.23
申请人 NITTO DENKO CORPORATION 发明人 INOUE YASUSHI;SUGIMOTO MASAKAZU;NAGASAWA MEGUMU;NAKAMURA KEI
分类号 H01L23/12;H01L23/31;H01L23/498;H05K1/02;H05K3/30;H05K3/34;(IPC1-7):H05K1/16 主分类号 H01L23/12
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