发明名称 |
Epoxy resin compositions for printed circuit board and printed circuit board using the same |
摘要 |
An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.
|
申请公布号 |
US6462147(B1) |
申请公布日期 |
2002.10.08 |
申请号 |
US19990274100 |
申请日期 |
1999.03.23 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
ARATA MICHITOSHI;TAKANO NOZOMU;FUKUDA TOMIO;TOMIOKA KENICHI |
分类号 |
C08G59/40;C08G59/50;C08G59/62;C08L63/00;H05K1/03;(IPC1-7):C08F283/00 |
主分类号 |
C08G59/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|