发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a polishing device capable of effectively carrying out highly smooth bowl feed polishing in a short time. SOLUTION: A ring shaped ventilation pipe 7 having many vent holes which are connected to an air pump 9 through the medium of a conduit 8 inside a bowl 1 is mounted with vent holes faced downward. An air pump 9 is controlled with a CPU 10 so as to gradually decrease an airflow rate fed into the ring shaped ventilation pipe 7 with the passage of time. When starting polishing, abrasives precipitating at the bottom of the bowl 1 are stirred up by air (air bubbles) 15 jetted forcibly out of vent holes of the ring shaped ventilation pipe 7, whereby a heavy and coarse abrasive particle is also provided to the fitting surface between a polishing plate 3 and a work piece 5. Since the airflow rate is decreased with the passage of time, particles precipitate gradually on the bottom of the bowl from heavier and coarser particle. Therefore, a particle diameter of a polishing particle supplied to the fitting surface between a polishing plate 3 and a work piece 5 is gradually changed from large to minute by the reducing airflow rate decreasing with the passage of time.
申请公布号 JP2002292564(A) 申请公布日期 2002.10.08
申请号 JP20010094798 申请日期 2001.03.29
申请人 SHIMADZU CORP 发明人 KAWADA MASARU;SANO KAORU
分类号 B24B57/02;B24B13/00;B24B37/00;(IPC1-7):B24B57/02 主分类号 B24B57/02
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