| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized imaging unit in which a solid imaging device is efficiently heat-radiated and the electric characteristics of the solid imaging device can be improved as a result. SOLUTION: The imaging unit is provided with an imaging device unit 34. The imaging device unit 34 is constituted by holding a solid imaging device 33 on an imaging device frame 38 on the top end side of which the outer periphery of an objective lens frame on the side of a base end is fitted. The imaging device frame 38 is provided with extension parts 38a on right and left sides. In the top end part of such an extension part 38a, the portion lower than almost the central axis of the imaging device unit 34 is further extended to the rear end side and forms a holding part 38b. In the solid imaging device 33, a heat radiation member 57 of high heat conductivity is arranged closely to the rear side thereof, and the gap between the heat radiation member 57 and the device 33 is filled with the resin of high heat conductivity. The heat radiation member 57 is abutted to the extension part 38a and fixed in surface contact with the fitting part of the imaging device frame 38.
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