| 摘要 |
PURPOSE:To provide a manufacturing method capable of manufacturing the semiconductor package and assuring thin and compact form at low cost with high reliability and high yield. CONSTITUTION:The semiconductor package is provided with a substrate 7 having wiring circuit including a connecting part, a semiconductor chip 8 packaged in facedown mode on one main surface of the substrate 7, a resin layer 11 filling up the gap between the lower surface of the semiconductor chip 8 and the upper surface of the substrate 7 as well as a planar outer connecting terminal 9 electrically connecting to the semiconductor chip 8 so as to be led out and exposed in the other main surface side of the substrate 7. On the other hand, the manufacturing method is composed of the four steps as follows, i.e., the first step of aligning and arranging step of the connecting part 7a of the substrate 7 corresponding to the electrode terminal part 8a of the semiconductor chip 8 with one main surface of the substrate 7 having a wiring circuit including the connecting part, the second step of fixing and connecting the connected parts of the connecting part 7a of the corresponded and aligned substrate 7 surface and that of electrode terminal part 8a of the semiconductor chip 8 to be assembled, the third step of filling the gap between the assembled substrate 7 surface and the lower surface of the semiconductor chip 8 and the fourth step of setting the filled up resin 11. |
