| 摘要 |
A catalyst-free, solvent-free plating resist solution consisting of a diallyl phthalate prepolymer having a molecular weight of about 4900 and a liquid epoxy compound such as 1, 2-epoxy ethylbenzene is disclosed. The plating resist solution contains about 0.1 to 3 parts by weight of the diallyl phthalate prepolymer to one part by weight of the liquid epoxy compound.
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