| 摘要 |
PURPOSE: To solve the problem of a circuit device mounting circuit elements on a supporting substrate, e.g. a ceramic substrate or a flexible sheet, that the thickness of the supporting substrate becomes an obstacle to reduction in the size and thickness of the circuit device. CONSTITUTION: Since a conductive pattern 51 is formed for each block on a conductive foil 60 using isolation trenches 61 and then a conductive plating layer 81 is arranged selectively on the conductive pattern 51, a resource saving fabrication method of circuit device suitable for mass production, in which a circuit element 52 can be die bonded stably and wire bonding can be performed stably, can be realized. |
