发明名称 |
HEATING CHAMBER OF MODULE IC TEST HANDLER |
摘要 |
PURPOSE: A heating chamber of a module IC test handler is provided, which improves a reliability in a high temperature by making a uniform temperature distribution in the heating chamber rapidly as occupying a small space on a motherboard of the handler. CONSTITUTION: A module IC test handler performs a test by mounting a plurality of module ICs(1) on sockets of a mother board. According to the heating chamber(100), a chamber housing(110) is installed around the socket of the mother board and seals up the module ICs mounted on the mother board. A radiation heater(120) is installed on an upper part in the chamber housing and generates a radiation. A metallic heat dissipation plate(130) is installed on a lower part of the radiation heater and is heated by the radiation of the radiation heater. And a plurality of ventilation fans(141,142,143,144) are installed on one side of the heat dissipation plate and convects a heat of the heat dissipation plate into the chamber housing by force. |
申请公布号 |
KR20020074845(A) |
申请公布日期 |
2002.10.04 |
申请号 |
KR20010014895 |
申请日期 |
2001.03.22 |
申请人 |
MIRAE CORPORATION |
发明人 |
KIM, DU CHEOL;LEE, WAN GU;SUN, GI SANG |
分类号 |
G01R31/26;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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