METHOD FOR REVERSIBLE SEALING PACKAGE OF MEMS DEVICE

摘要

PURPOSE: A method for reversible sealing package of an MEMS(Micro Electro Mechanical System) device is provided to adhere easily a glass to a substrate by using a low temperature direct adhesion method. CONSTITUTION: A deep silicon etching process is performed on an upper portion of a 4 inch double side polished silicon substrate. A preparation process is performed to adhere a glass to the 4 inch double side polished silicon substrate. A cleaning process is performed during 10 minutes by using an SPM(Sulfuric-Perooxide-Mixture) rinse solution. The cleaning process is performed during 20 minutes by using RCA rinsing solution of 80 degrees centigrade. A rinsing process is performed by using deionized water. The adhering state between the glass and the silicon substrate is improved by performing a thermal process. The glass is separated from the silicon substrate.