| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a substrate having built-in parts and high connection reliability can be manufactured through a simple manufacturing process. SOLUTION: Wires 13 and 23 which become conductor paths between electronic parts and the surface 3A of a resin layer 3 are respectively erected on the terminal sections 11 and 21 of an MPU chip 10 and a chip capacitor 20, and buried in the resin layer 3 together with the chip 10 and the capacitor 20. Thereafter, the upper ends 13B and 23B of the wires 13 and 23 are exposed on the surface 3A of the resin layer 3 in a state where the ends 13B and 23B are flushed with the surface 3A in a grinding step. Since the upper ends 13B and 23B of the wires 13 and 23 are surely positioned on the surface 3A of the resin layer 3, the connection reliability of the substrate can be secured. In addition, the manufacturing process of the substrate can be simplified, because the burying of the wires 13 and 14 in the resin layer 3 and the formation of the conductor paths can be performed in the same step even when the electronic parts have different thicknesses. |
