| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the improved support of circuit boards that is quickly assembled, inhibits bending in the circuit board, and supports a heat sink. SOLUTION: The improved support 110 of the circuit board 102 is quickly assembled, inhibits the bending in the circuit board, and supports a heat sink 106. In this case, an apparatus being suitable for supporting the circuit board includes a support being suitable for mounting to a chassis of an information processing system, and the heat sink is mounted to the support via a printed circuit board, thus supporting the heat sink by the chassis.</p> |
