| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which can be protected against separation around interfaces and cracking when insulating layers having different burning shrinkage behaviors are laminated into the laminated insulating layers, and a conductor layer is formed at each interface between the laminated insulating layers for the formation of the circuit board. SOLUTION: Ceramic insulating layers 1a and 1g whose burning shrinkage starting temperatures are T1 and T2 (T1<T2) and ceramic insulating layers 1b to 1f are laminated into an insulating board 1, and a ceramic circuit board 10 is equipped with the insulating board 1. An inner conductor layer 3b is provided to an interface between the insulating layers 1a and 1b, and an inner conductor layer 3a is provided to an interface between the insulating layers 1f and 1g, where the conductor layers 3a and 3b are formed of conductor material whose burning volume shrinkage factor is 15% or below with a temperature change from T1 to T3, especially 10% or below with a temperature change from a room temperature to T1. |
