| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an IC card, capable of preventing occurrence of warping, waviness, irregularities, etc., when it is subjected to heat treatment. SOLUTION: A circuit 28, constituted by including an IC chip 26, is formed on a surface of a hot melt 21, the circuit 28 is covered by arranging a hot melt 29 on the surface side of the formed circuit 28, and labels 30, 31 are arranged on respective outer surface sides of the hot melt 29, 21. Thereafter, the IC card 32 is manufactured by cooling the hot melt 21, 29, after once melting them by subjecting them to heat treatment. |
