| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that malfunction wherein the ball grid of a BGA package is peeled from a wiring terminal occurs in that the deformation of the BGA package does not follow the deformation of a printed circuit board by the difference of rigidity when the printed circuit board receives external force to be warped although the ball grid provided on the BGA package is overlapped with the wiring terminal provided on the surface of the printed circuit board to be heated and melted, so that the BGA package can be fixed on the printed circuit board. SOLUTION: A semiconductor chip 14 and a solder ball 12 are adhered to an area different in a flexible tape 11 by using the flexible tape 11, a silicon resin 18 is sandwiched therebetween as a buffering material, the strain of the printed circuit board 1 mitigates influence exerted on the tape area of the semiconductor chip 14, and the malfunction wherein the solder ball is peeled from the wiring terminal is prevented. |
