| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is improved in durability by enhancing the adhesion of a wiring circuit layer to an insulating sheet when the wiring circuit layer is formed on the surface of the thermosetting resin-containing insulating sheet by transfer. SOLUTION: A thermosetting resin-containing uncured or semi-cured insulating sheet 1 is formed, a metal foil is bonded on the surface of a prescribed transfer film 5 and then subjected to etching for the formation of a wiring circuit layer 4, and then the wiring circuit layer 4 is transferred onto the surface of the insulating sheet 1. Before the wiring circuit layer 4 formed on the surface of the transfer film 5 is transferred onto the surface of the insulating sheet 1, the surface of the wiring circuit layer 4 which is to come into contact with the insulating sheet 1 is subjected to plasma processing or subjected to a surface- roughening process before plasma processing. |
