MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminated board which is excellent in high frequency characteristics, mechanical strength and workability. SOLUTION: The multilayer wiring board is constructed by stacking a board provided with wiring layers on an insulating base material containing a polybutadiene or a polyisoprene and a conductive layer provided with a circuit pattern through an insulating resin layer, formed by impregnating a thermosetting resin containing an epoxy resin, into a sheet-like base material. The bonding strength between the insulating resin layer and the conductive layer is set to be 0.8 kN/m or more.