| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a position difference of a semiconductor element and the adhesion of melting solder and/or flux to the surface (light receiving surface) of the semiconductor element in mounting the thin semiconductor element on a circuit board. SOLUTION: The substrate for mounting the semiconductor element having a circuit pattern that comprises a plurality of islands, each being electrically insulated, which consist of an electrode connection part of the semiconductor element and an external terminal installation part electrically connected to the electrode connection part, is characterized in that the electrode connection part of the semiconductor element is formed larger than an electrode part of the semiconductor element and a groove is formed between the electrode connection part and the external terminal installation part.</p> |
