| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module with built-in components which has high reliability and is suitable for high density mounting. SOLUTION: The module has an electric insulating layer 101, a plurality of first wiring patterns 102a and 102b which are laminated trough the layer 101, at least one first inner via 104 for electrically connecting between the first wiring patterns provided on different layers, at least one electronic component 103 embedded inside the layer 101 and mounted on the one of the first wiring patterns. At least one of the inner via holes 104 occupies the range overlapping the range occupied by the component 103 in the laminating direction of the wiring patterns 102a and 102b, and its height is lower than that of the component 103 in this direction. Since the inner vias are low in height, the diameter of the via holes can be made to be small. Accordingly, the module with built-in components which has high reliability and is suitable for high density mounting can be provided.</p> |
