METHOD FOR JOINING SEMICONDUCTOR ELEMENT AND JOINING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a joining method and a joining apparatus which can fix a heating device on a holder of a semiconductor element side and can join the semiconductor element whose cost is low and has high reliability. SOLUTION: The joining method, which joins an extruded metal electrode 4 formed on a semiconductor element 3 to an electrode 2 of a substrate 1, is composed of a process for abutting the heated extruded electrode 4 against the electrode 2 of the heated substrate and a process for applying a ultrasonic vibration 7A to the substrate in the abutting state.