SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To eliminate the restriction of an area for forming a solder bump due to the presence of on area for forming a fuse and the restriction of the layout of rewiring for connecting the solder bump and an electrode pad. SOLUTION: After a fuse blow step, a substrate surface including the fuse- forming area is covered with an insulation film to form a rewiring layer and the solder bump on the insulation film. Thus, the restriction of the rewiring layout due to the presence of the fuse forming area is eliminated.