PROTECTIVE FILM FORMING SHEET FOR CHIP, AND METHOD OF FABRICATING SEMICONDUCTOR CHIP

摘要

PURPOSE: To provide a protective film forming sheet for chip, which allows easier formation of a highly uniform protective film at the rear surface of chip and can eliminate adverse effects resulting from damages, even if fine damages are formed on the rear surface of chip through mechanical cutting process. CONSTITUTION: This protective film forming sheet for chip includes a peeling sheet and a protective film forming layer, which is composed of a thermal or energy setting element formed on the peeling surface of the peeling sheet and a binder polymer element.