| 摘要 |
PROBLEM TO BE SOLVED: To provide a tag with built-in IC capable of preventing breakage of an IC circuit and printing failure, at printing with a thermal head. SOLUTION: Upper paper 51 of the tag 50 with built-in IC is constituted to be thick and hard to be deformed of a PET film, and an adhesive 52 on the side of the upper paper 51 on the IC circuit is constituted thin, and an adhesive 53 on the side of back paper 54 is constituted to be large in thickness of a hot melt adhesive. |
