| 摘要 |
PROBLEM TO BE SOLVED: To improve cooling efficiency for a semiconductor chip. SOLUTION: The semiconductor chip 3 has an electrode plate 3a and a semiconductor circuit part 3b, and a plurality of groove parts 3c are formed inside the semiconductor circuit part 3b. A Peltier element 11 is arranged on each of the groove parts 3c. A resin insulator 20 is filled between the Peltier element 11 and the inner face of the groove part 3c. In this constitution, the Peltier element 11 is buried inside the semiconductor chip 3, and an insulation board 2 does not exist between the Peltier element 11 and the semiconductor circuit part 3b being a cooling object. Thus, the cooling efficiency is improved by the part. In addition, a distance between the semiconductor chip 3 and a heat sink 7 is very short, and a cooling effect by heat dissipation of the semiconductor chip 3 itself can be expected. |
