| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed board wherein its connective reliability can be prevented from so reducing that its conductive paste is peeled in its via hole due to the deformation of its via hole when its layers are connected with each other. SOLUTION: In the manufacturing method of the printed board comprising two layers wherein single-sided conductor-pattern films are laminated, heated, and pressed, a land portion 32a of a conductor pattern 32 of the single-sided conductor-pattern film which is the lower layer of the two layers and is located under a via hole 24 is so formed that a plurality of recessed portions 32b are arranged in its peripheral portion. Therefore, when heating and pressing the printed board, even though the resin film of the periphery of the via hole 24 is deformed, the deformed film so penetrates the space portions formed out of the recessed portions 32b as to make reducible the deformation amount of the via hole 24. |
