| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which is capable of manufacturing a wiring board equipped with a buildup layer formed on one surface of its core board with a recess at a low cost. SOLUTION: A wiring board manufacturing method comprises a first process of providing through-hole conductors 12 which are bored in a first thin-walled core board 2, penetrating through its front and rear surface, 3 and 4, forming a wiring layer 20 on the front surface 3, and forming wiring layers 17 and 19 on the rear surface 4; a second process of forming U-shaped grooves 6a which are nearly rectangular on a plan view on the surface 7 of a second thick- walled core board 6 and wiring layers 18 around the grooves 6; a third process of laminating and bonding the first core board 2 and the second core board 6 through the intermediary of an adhesive layer (prepreg) 5 together; and a fourth process of forming a through-hole conductor 15 which is bored in the core boards 2 and 6 to penetrate through both the surface 3 of the board 2 and the surface 8 of the board 6; and a fifth process of forming a wiring layer 21 on the rear 8 of the second core board 6. |
