| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board having a high density and an IVH structure with high yield by the use of only one- sided circuit boards. SOLUTION: A multilayer printed wiring board is manufactured through a method which comprises a process of manufacturing a one-sided circuit board that is equipped with a conductor circuit composed of a circuit pattern formed on one surface of an insulating base material and a viahole formed in a blind hole leading to the circuit pattern from the other surface of the insulating base material, laminating the above one-sided circuit boards, and thermocompressing them in a lot into the multilayer printed wiring board. The above method is carried out as follows: An insulating base material is previously wound on one of two reels arranged apart from each other, the free end of the insulating base material is wound on the other reel, and the insulating base material is intermittently moved. A conductor circuit is formed in the prescribed region on the insulating base material at every intermittent movement, and then the insulating base material where the conductor circuits have been successively formed is cut into the unit one-sided circuit boards each having the prescribed regions. |
