| 摘要 |
PROBLEM TO BE SOLVED: To restrain organic solvent like IPA from dissolving in pure water. SOLUTION: This substrate treating equipment for performing drying treatment of a wafer wherein cleaning treatment using pure water is finished is provided with a treatment vessel 20 for storing pure water, dipping a wafer W in the pure water and performing cleaning treatment of the wafer; discharge piping 22 which is connected continuously with the vessel 20 and discharges the pure water therefrom; an on-off valve 23 for adjusting whether discharge of the pure water from the piping 22 exists; a container 10 for accommodating the vessel 20; a gas supplying nozzle 50 for supplying the IPA, the organic solvent, to the container 10; elevating mechanism 30 for pulling up the wafer wherein the cleaning treatment is finished from the vessel 20 in the container 10; and a control unit 60 for supplying the IPA to the container 10 from the nozzle 50 in the state that treating liquid is not discharged by the valve 23, after the wafer W is pulled up from the vessel 20 by the elevating mechanism 30, and the pure water in the vessel 20 is discharged by controlling the valve 23.
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