发明名称 POWER SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To create a device for centering each constituent element of sandwiches relative to each other constituent element and relative to a connection element for electrical connection. SOLUTION: The sandwiches (10, 11, 12) are centered by use of a centering device (9) of a frame state on an electrical first connection element, the centering device (9) is formed such that a plane first metal body (12) and a plane second metal body (10) are prevented from dropping by use of a nose (2), and a semiconductor component (11) is supported by a concave portion (3) that extends in parallel with the surface inside the centering device (9) at the center. Thus, the centering device on the electrical first connection element is used as a device that perform the centering of all of constituent parts of the sandwiches without using a compressive force.
申请公布号 JP2002289630(A) 申请公布日期 2002.10.04
申请号 JP20010383272 申请日期 2001.12.17
申请人 SEMIKRON ELEKTRON GMBH 发明人 KRONEDER CHRISTIAN
分类号 H01L21/52;H01L23/051;H01L23/16;(IPC1-7):H01L21/52 主分类号 H01L21/52
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