| 摘要 |
PROBLEM TO BE SOLVED: To prevent excess melting of copper of a lead wire in a lower part of a solder resist and suppress the whisker of tin plating in a semiconductor device tape carrier. SOLUTION: The solder resist 6 is applied in a position except its terminal portion on a copper foil wiring pattern 3 which is formed on a dielectric film 1 via an adhesive layer 2, thereafter, a thin tin-plated layer of 0.01 to 0.2 μm in thickness is formed on the terminal portion as first tin plating treatment, and a pure tin layer 4a and a tin-copper alloy layer 5a of 0.20 μm or less are formed by heat treatment. Then, a pure tin plating layer of 0.15 to 0.80 μm in thickness is formed on the terminal portion as a second tin plating treatment, and a pure tin layer 4b of 0.15 to 0.80 μm in thickness and a tin-copper alloy layer 5b of 0.20 μm or more in thickness are formed by heat treatment. |
