发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting system in which transmission of vibration to or from a supporting face can be reduced. SOLUTION: An electronic component mounting system is installed on the floor surface 10 through four sets of vibration transmission reducer 12. The vibration transmission reducer 12 comprises a receiving member 90 having a concave face 148 mounted on the floor surface 10, and a holding member 92 secured to the frame 96 of the apparatus body 22 while holding a wheel 94. The wheel 94 is received in the concave face 148 rotatably about a horizontal axis orthogonal to the moving direction of the component feeding table in an electronic component feeder. At the time of mounting an electronic component on a printed board, the apparatus body vibrates based on the acceleration/ deceleration of various compositional members of the electronic component mounting system, but the wheel 94 rolls on the concave face 148 and the apparatus body 22 moves in the horizontal direction in parallel with the moving direction of the component feeding table with respect to the floor surface 10 thus lessening transmission of vibration to the floor surface 10.
申请公布号 JP2002290100(A) 申请公布日期 2002.10.04
申请号 JP20010093179 申请日期 2001.03.28
申请人 FUJI MACH MFG CO LTD;AS:KK 发明人 SUHARA SHINSUKE;ENOMOTO TAKAO
分类号 F16F15/02;F16F15/04;H05K13/04 主分类号 F16F15/02
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