| 摘要 |
PROBLEM TO BE SOLVED: To provide a processor which can carry out a series of processes containing a resist application and a development process after exposed for a processing substrate at a high throughput containing the pre-process and the post-process, and can additionally reduce a foot-print as much as possible. SOLUTION: In any case, a substrate G is substantially carried, while a predetermined process is carried out. A processor has a cleaning unit 21, a resist processing unit 23 and a developing unit 43, and further has a plurality of thermal treatment unit sections 24, 25, 44 which collect a plurality of thermal treatment units for conducting a thermal treatment incidental to each processing unit. The cleaning unit 21 and the resist processing unit 23 are present on the one side across an aligner 3, and the developing unit 43 is present on the other side. |
