| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an excellent semiconductor device wherein a decoupling capacitor can be provided closely to the mounting position of its semiconductor chip, and it has an excellent power-supply stability in a high-frequency region which can be used effectively for the processings of high-speed signals, etc. SOLUTION: In a wiring board having at least a signal layer, a power-supply layer, a grounded layer, and an insulation layer, there is provided between the power-supply layer and the grounded layer a dielectric layer containing composite particles for dielectrics wherein each particle is an inorganic one having a dielectric constant not smaller than 30 and a portion or the whole of its surface is coated with a conductive metal, the compound thereof, a conductive organic compound, or a conductive inorganic substance.</p> |
