发明名称 SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a surface acoustic wave device whose reliability and yield are improved, and also to provide its manufacturing method. SOLUTION: The surface acoustic wave device 10 is provided with a surface acoustic wave element 50 and electronic components 40 for driving and controlling the element 50. A first hollow part 12 having an opening part 14 for storing the electronic components 40 is formed in the device 10. The surface acoustic wave device 10 is also provided with a first baseboard 11, having a first connection terminal 13 to be electrically connected to the electronic components 40, formed in the first hollow part 12 and having a second connection terminal 17 electrically connected to the first connection terminal 13, with a second baseboard 20 jointed to the opening part 14 of the first baseboard 11 at one surface side 20a and where the surface acoustic wave element 50 is mounted to be electrically connected to the second connection terminal 17 at the other surface side 20b, and with a cap 30 which is jointed to the first baseboard 11 and is provided with a second hollow part 1 for airtightly sealing the surface acoustic wave element 50.
申请公布号 JP2002290200(A) 申请公布日期 2002.10.04
申请号 JP20010088424 申请日期 2001.03.26
申请人 SEIKO EPSON CORP 发明人 KINOSHITA YUSUKE
分类号 H03B5/30;H03H3/08;H03H9/05;H03H9/10;H03H9/25;(IPC1-7):H03H9/25 主分类号 H03B5/30
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