发明名称 SURFACE TREATMENT METHOD AND APPARATUS, AND SOLID JOINTING METHOD
摘要 PROBLEM TO BE SOLVED: To uniformly treat the surface of a member to be processed, even though irregularities exist on the surface. SOLUTION: A surface treatment apparatus 30 is provided with a treatment stage, where a member 10 is located inside a treatment chamber 31. Treatment gas is supplied to the treatment chamber 31 from a treatment gas supply section 40 through supply pipeline 38. An electron beam irradiation unit 34 is mounted at the ceiling of the treatment chamber 31. The electron beam irradiation unit 34 irradiates the treatment gas introduced to the treatment chamber 31 for activation with electron beam 36. The activated treatment gas contacts the member 10 and performs its surface treatment.
申请公布号 JP2002289605(A) 申请公布日期 2002.10.04
申请号 JP20010092702 申请日期 2001.03.28
申请人 SEIKO EPSON CORP 发明人 MIYAJIMA HIROO;AOKI KOJI;SUZUKI TAKAYUKI;AKIYAMA HIROAKI
分类号 C23C8/38;C23C14/12;C23C14/48;H01L21/265;H01L21/302;H01L21/3065;H01L21/316;H01L21/318;(IPC1-7):H01L21/316;H01L21/306 主分类号 C23C8/38
代理机构 代理人
主权项
地址