| 发明名称 |
SEMICONDUCTOR PACKAGE, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package for forming connecting protrusions (bump) at the arbitrary part of a substrate without using a ball solder. SOLUTION: Heat resistant protection films 14 are layered on one face 4b of a circuit board 4, a metal column material 7 is buried in a through hole 6 which is formed by punching them and connected to a conductor pattern 3. |
| 申请公布号 |
JP2002289744(A) |
申请公布日期 |
2002.10.04 |
| 申请号 |
JP20010093244 |
申请日期 |
2001.03.28 |
| 申请人 |
SUZUKI CO LTD |
发明人 |
KARASAWA FUMIAKI;NAKAMURA TOSHIYUKI |
| 分类号 |
H01L23/12;H01L23/50;H01L23/52;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/12 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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