发明名称 Method of and apparatus for thermal analysis, method of and apparatus for calculating thermal conditions, computer product
摘要 The physical property data of the object to be heated, set temperatures of heaters and blowers are provided to a reflow apparatus, and view factor setting data for determining the view factor of the surface-mounted circuit board are input. From the input these data, the number of heaters and blowers, and the heating characteristic data peculiar to the reflow apparatus, such as the heat transfer coefficient, the speed of conveyor and the like, the view factor is simply determined, and the temperature of the surface-mounted circuit board at the time of passing through the reflow apparatus is calculated with respect to the board and parts mounted thereon, using the determined view factor.
申请公布号 US2002139792(A1) 申请公布日期 2002.10.03
申请号 US20010916584 申请日期 2001.07.30
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 NOBUHARA YURIKO;KIMURA NAOKI;NAKAMURA YOSHIO;ISOGAI SATORU
分类号 B23K3/04;B23K1/00;B23K1/008;B23K31/02;B23K101/42;G01K7/42;H05K3/34;(IPC1-7):H05B1/02 主分类号 B23K3/04
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