| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation member for an electronic apparatus which has low thermal expansibility and high thermal conductivity. SOLUTION: The heat radiation member for an electronic apparatus consists of SiC coarse particles having a large average particle size, SiC fine particles having a small average particle size, and a matrix metal essentially consisting of Al, and in which SiC coarse particles and SiC fine particles are dispersed. The heat radiation member for an electronic apparatus consists of a composite material in which the SiC coarse particles and the SiC fine particles are present at the packing ratio of 65 to 75 vol.% provided that the whole is 100 vol.%, and the volume ratio of the SiC coarse particles to the SiC fine particles is 1.5 to 4, and the average particle size ratio of the SiC coarse particles to the SiC fine particles is 10 to 15. By suitably selecting the average particle size ratio, volume ratio and packing ratio of the SiC particles, the coexistence of the low thermal expansibility and high thermal conductivity of the heat radiation member consisting of the Al-SiC composite material can be attained. |
