ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD PRODUCING THE DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive sheet used as a dicing tap in a dicing process, having excellent bonding reliability between a semiconductor device and a support member. SOLUTION: This adhesive sheet has an adhesive layer containing (A) an epoxy resin and an epoxy resin curing agent, (B) a high-molecular weight component which contains a functional monomer and >=100,000 weight-average molecular weight and (C) a radiation-polymerizable compound and a substrate layer >40 mN/m surface tension. The adhesive sheet has thermal polymerizability and radiation polymerizability.