| 摘要 |
A method of manufacturing a semiconductor light-emitting device includes: a step of forming a stacked semiconductor layer having a plurality of columnar portions over a semiconductor substrate, a step of forming an embedding insulation layer of a resin material around each of the columnar portions, and a step of separating a wafer to form chips. In the step of forming the stacked semiconductor layer having the columnar portions, a separating semiconductor layer of a given pattern is formed in boundary regions of the chips; in the step of forming the embedding insulation layer, at least an upper surface of the separating semiconductor layer is exposed; and in the step of forming the chips, the separation is carried out using the separating semiconductor layer.
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