| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant polymer film having excellent heat- resistance, strength and dimensional stability and improved moisture absorption to enable the use as a semiconductor mounting board. SOLUTION: The heat-resistant polymer film contains a heat-resistant polymer and hydrophobic particles. The hydrophobic particle has an average particle diameter of >=0.001μm and <=20μm and a hydrophobicity of >=10. The volume ratio of the particle in the heat-resistant polymer film is >=5 vol.% and <=55 vol.%.
|
