| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive solder resist composition excellent in characteristics of stability after mixing with a hardening agent, resistance against gold plating, resistance against low temperature shock, electric insulating property and so on. SOLUTION: The composition contains (A) a resin containing radical polymerizable groups and carboxyl groups obtained by adding cyclic ether groups of vinyl monomers containing cyclic ether groups to carboxyl groups of radical copolymers containing at least isobornyl (meth)acrylates and vinyl monomers containing carboxyl groups as the monomer units, (B) an inorganic filler, and (C) a photosetting mixture consisting of polyfunctional acryl monomers (c1), alicyclic epoxy compounds (c2) and a photopolymerization initiator (c3). |
