| 摘要 |
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers ( N >2) and N metal planes formed in the following sequence: dielectric layer 1 on a metallic plane that exists on a surface of the substrate, metal plane 1 on dielectric layer 1, dielectric layer 2 on dielectric layer 1 and metal plane 1, metal plane 2 on the dielectric layer 2, . . . , dielectric layer N on dielectric layer N-1 and metal plane N-1, and metal plane N on the dielectric layer N. Metal planes or metallic planes may include signal planes, power planes, ground planes, etc. A microvia structure, which is formed through the N dielectric layers and electrically couples metal plane N to the metallic plane, includes a microvia or a portion of a microvia through each dielectric layer.
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