发明名称 Mounting apparatus of electronic parts and mounting methods of the same
摘要 An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.
申请公布号 US2002138977(A1) 申请公布日期 2002.10.03
申请号 US20020087927 申请日期 2002.03.05
申请人 NAGAO KAZUHIDE;TSUTSUMI TAKUYA;NODA TAKAHIRO;SUMI HIDEKI 发明人 NAGAO KAZUHIDE;TSUTSUMI TAKUYA;NODA TAKAHIRO;SUMI HIDEKI
分类号 H05K13/00;H05K13/04;(IPC1-7):H05K3/30;B23P19/00 主分类号 H05K13/00
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