发明名称 |
Mounting apparatus of electronic parts and mounting methods of the same |
摘要 |
An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.
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申请公布号 |
US2002138977(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20020087927 |
申请日期 |
2002.03.05 |
申请人 |
NAGAO KAZUHIDE;TSUTSUMI TAKUYA;NODA TAKAHIRO;SUMI HIDEKI |
发明人 |
NAGAO KAZUHIDE;TSUTSUMI TAKUYA;NODA TAKAHIRO;SUMI HIDEKI |
分类号 |
H05K13/00;H05K13/04;(IPC1-7):H05K3/30;B23P19/00 |
主分类号 |
H05K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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