| 摘要 |
According to the invention, an optimal emission from a diode chip (1) may be achieved, whereby a number of microcondenser lenses (2) are arranged on each of the six rectangular base surfaces (3, 4, 5, 6, 7, 8) of the diode chip (1). Any number of diode chips (1) can be cascaded by means of just three base components (30, 40, 50). Soldering of the diodes can be avoided by means of conducting plastic, such that said components permit high-performance lighting applications, such as for example, car headlights or projection surfaces, to be produced in an economical and energy-saving manner. |
