DEVICE FOR JOINING SUBSTRATES

摘要

The invention relates to a device for joining substrates (3, 4) having an inner whole to give a wafer. The aim of the invention is provide a simple and inexpensive device that allows for a simultaneous rotation of the two substrates (3, 4) during gluing. To this end, the device has an element that can be inserted in the inner whole of at least two superimposed substrates (3, 4) and that can be expanded to close an interstice (30) between the substrates.