发明名称 METHOD FOR FORMING METAL PATTERN
摘要 <p>A method for forming a metal pattern on a substrate characterized in that a photosensitive resin composition comprising polysilane having weight-average molecular weight of 10000 or above and being soluble to an organic solvent, a photoradical generating agent, an oxidizing agent, a silicon compound containing alkoxy group, and an organic solvent is applied onto the substrate to form a photosensitive layer, the photosensitive layer is exposed selectively to form a latent image part of the metal pattern, a liquid containing a salt or colloid of a metal having a standard electrode potential lower than that of a metal being deposited at the latent image part is touched to the photosensitive layer in order to adsorb a metal or metal colloid having a low standard electrode potential to the latent image part, and an electroless plating liquid is touched to the photosensitive layer in order to deposit a metal film on the latent image part where a metal or metal colloid having a low standard electrode potential is adsorbed thus forming a metal pattern.</p>
申请公布号 WO2002077321(P1) 申请公布日期 2002.10.03
申请号 JP2002002632 申请日期 2002.03.20
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