| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having excellent flowability and curability, reduced warpage after molding and on soldering treatment, and properties having excellent soldering crack resistance. SOLUTION: The epoxy resin composition comprises (A) a crystalline epoxy resin to be obtained by reacting 1,5-dihydroxynaphthalene with epichlorohydrin andβ-methylepichlorohydrin, (B) a phenolic resin, (C) a curing accelerator, and (D) an inorganic filler.
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