发明名称 |
ELECTROCONDUCTIVE CONNECTING FILM AND METHOD FOR PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive connecting film capable of omitting an injecting step of a sealing resin without leaking from an adjacent electrode and easily carrying out electric connection with high reliability in a short time in connecting a semiconductor package to a substrate, and a method for producing the electroconductive connecting film. SOLUTION: This electroconductive connecting film is characterized by arranging electroconductive parts composed of a solder alloy paste comprising metal fine particles dispersed therein on a film having through-holes by screen printing.
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申请公布号 |
JP2002285136(A) |
申请公布日期 |
2002.10.03 |
申请号 |
JP20010090687 |
申请日期 |
2001.03.27 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
NAKAMURA KAZUHIKO;SUZUKI TAKUO |
分类号 |
C09J7/02;C09J9/02;C09J201/00;H01B5/16;H01B13/00;(IPC1-7):C09J201/00 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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