发明名称 ELECTROCONDUCTIVE CONNECTING FILM AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electroconductive connecting film capable of omitting an injecting step of a sealing resin without leaking from an adjacent electrode and easily carrying out electric connection with high reliability in a short time in connecting a semiconductor package to a substrate, and a method for producing the electroconductive connecting film. SOLUTION: This electroconductive connecting film is characterized by arranging electroconductive parts composed of a solder alloy paste comprising metal fine particles dispersed therein on a film having through-holes by screen printing.
申请公布号 JP2002285136(A) 申请公布日期 2002.10.03
申请号 JP20010090687 申请日期 2001.03.27
申请人 SEKISUI CHEM CO LTD 发明人 NAKAMURA KAZUHIKO;SUZUKI TAKUO
分类号 C09J7/02;C09J9/02;C09J201/00;H01B5/16;H01B13/00;(IPC1-7):C09J201/00 主分类号 C09J7/02
代理机构 代理人
主权项
地址