ONE-COMPONENT ADHESIVE FOR ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a one-component adhesive for electronic parts, suppressing a drawback of a conventional epoxy resin adhesive which is the lowering of the elastic modulus at a higher temperature than the Tg of the epoxy resin and enabling the improvement of heat resistance and adhesivity. SOLUTION: The adhesive composition composed of an epoxy resin, dicyandiamide and a cure accelerator further contains water and an epoxy silane as essential components. The present invention further relate to a cured product of the composition.